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From zero- to second-level packaging of RF-MEMS devices

dc.contributor.authorJourdain, Anne
dc.contributor.authorVaesen, Kristof
dc.contributor.authorScheer, Jacco
dc.contributor.authorWeekamp, Wim
dc.contributor.authorvan Beek, Joost
dc.contributor.authorTilmans, Harrie
dc.date.accessioned2021-10-16T02:23:52Z
dc.date.available2021-10-16T02:23:52Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10665
dc.sourceIIOimport
dc.titleFrom zero- to second-level packaging of RF-MEMS devices
dc.typeProceedings paper
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.source.peerreviewno
dc.source.beginpage36
dc.source.endpage39
dc.source.conferenceProceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems - MEMS
dc.source.conferencedate30/01/2005
dc.source.conferencelocation
imec.availabilityPublished - imec


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