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Electro-migration behavior of Pb-free flip chip bumps

dc.contributor.authorLabie, Riet
dc.contributor.authorWebers, Tomas
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-16T02:41:40Z
dc.date.available2021-10-16T02:41:40Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10731
dc.sourceIIOimport
dc.titleElectro-migration behavior of Pb-free flip chip bumps
dc.typeProceedings paper
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage382
dc.source.endpage384
dc.source.conferenceProceedings 15th European Microelectronics and Packaging Conference and Exhibition
dc.source.conferencedate12/07/2005
dc.source.conferencelocationBrugge Belgium
imec.availabilityPublished - imec


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