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Barrier integrity effect on leakage mechanism and dielectric reliability of copper/OSG interconnects

dc.contributor.authorLi, Yunlong
dc.contributor.authorTokei, Zsolt
dc.contributor.authorMandrekar, T.
dc.contributor.authorMebarki, Bencherki
dc.contributor.authorGroeseneken, Guido
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-16T02:54:56Z
dc.date.available2021-10-16T02:54:56Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10779
dc.sourceIIOimport
dc.titleBarrier integrity effect on leakage mechanism and dielectric reliability of copper/OSG interconnects
dc.typeProceedings paper
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage265
dc.source.endpage270
dc.source.conferenceMaterials, Technology, and Reliability of Advanced Interconnects Interconnects
dc.source.conferencedate28/03/2005
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access
imec.internalnotesMRS Symposium Proceedings; Vol. 863


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