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Probabilistic design approach for package design and solder joint reliability optimization for a lead free BGA package

dc.contributor.authorLimaye, Paresh
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVan de Peer, Joost
dc.contributor.authorDonders, S.
dc.contributor.authorDarveaux, Robert
dc.date.accessioned2021-10-16T02:56:41Z
dc.date.available2021-10-16T02:56:41Z
dc.date.issued2005-04
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10785
dc.sourceIIOimport
dc.titleProbabilistic design approach for package design and solder joint reliability optimization for a lead free BGA package
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewno
dc.source.beginpage531
dc.source.endpage537
dc.source.conferenceProceedings of the 6th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics
dc.source.conferencedate17/04/2005
dc.source.conferencelocationBerlin Belgium
imec.availabilityPublished - imec


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