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Crack growth rate measurement and analysis for WLCSP Sn-Ag-Cu solder joints

dc.contributor.authorLimaye, Paresh
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVerlinden, Bert
dc.contributor.authorVandepitte, Dirk
dc.date.accessioned2021-10-16T02:56:57Z
dc.date.available2021-10-16T02:56:57Z
dc.date.issued2005-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10786
dc.sourceIIOimport
dc.titleCrack growth rate measurement and analysis for WLCSP Sn-Ag-Cu solder joints
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewno
dc.source.beginpage371
dc.source.endpage377
dc.source.conferenceSMTA International Annual Conference
dc.source.conferencedate25/09/2005
dc.source.conferencelocationChicago, IL USA
imec.availabilityPublished - imec


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