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Issues and opportunities in thin film MCM

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-09-29T14:16:54Z
dc.date.available2021-09-29T14:16:54Z
dc.date.issued1996
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1082
dc.sourceIIOimport
dc.titleIssues and opportunities in thin film MCM
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage83
dc.source.endpage87
dc.source.conferenceProceedings of EuPaC'96. 2nd European Conference on Electronic Packaging Technology
dc.source.conferencedate31/01/1996
dc.source.conferencelocationEssen Germany
imec.availabilityPublished - open access
imec.internalnotesDVS; Vol. 173


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