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Repair and sealing of mesoporous low-k dielectric by supercritical CO2 processing

dc.contributor.authorMalhouitre, Stephane
dc.contributor.authorVan Hoeymissen, Jan
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorKesters, Els
dc.contributor.authorGranger, P.
dc.date.accessioned2021-10-16T03:13:04Z
dc.date.available2021-10-16T03:13:04Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10839
dc.sourceIIOimport
dc.titleRepair and sealing of mesoporous low-k dielectric by supercritical CO2 processing
dc.typeProceedings paper
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorKesters, Els
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.source.peerreviewno
dc.source.conferenceSEMATECH Surface Preparation and Cleaning Conference
dc.source.conferencedate19/04/2005
dc.source.conferencelocationAustin, TX USA
imec.availabilityPublished - imec


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