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Technology for embedding active dies

dc.contributor.authorOstmann, A.
dc.contributor.authorDe Baets, Johan
dc.contributor.authorKriechbaum, A.
dc.contributor.authorKostner, H.
dc.contributor.authorNeumann, A.
dc.date.accessioned2021-10-16T03:49:43Z
dc.date.available2021-10-16T03:49:43Z
dc.date.issued2005-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10967
dc.sourceIIOimport
dc.titleTechnology for embedding active dies
dc.typeProceedings paper
dc.contributor.imecauthorDe Baets, Johan
dc.source.peerreviewno
dc.source.beginpage101
dc.source.endpage106
dc.source.conferenceProceedings of the 15th European Microelectronics and Packaging Conference - IMAPS
dc.source.conferencedate12/06/2005
dc.source.conferencelocationBrugge Belgium
imec.availabilityPublished - imec


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