Direct copper plating on highly resistive barrier layers
dc.contributor.author | Palmans, Roger | |
dc.date.accessioned | 2021-10-16T03:51:29Z | |
dc.date.available | 2021-10-16T03:51:29Z | |
dc.date.issued | 2005 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/10973 | |
dc.source | IIOimport | |
dc.title | Direct copper plating on highly resistive barrier layers | |
dc.type | Meeting abstract | |
dc.source.peerreview | no | |
dc.source.beginpage | 667 | |
dc.source.conference | Meeting Abstracts 208th Meeting of the Electrochemical Society. Science, Technology, and Tools for Electrodeposition | |
dc.source.conferencedate | 17/10/2005 | |
dc.source.conferencelocation | Los Angeles, CA USA | |
imec.availability | Published - imec |
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