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Direct copper plating on highly resistive barrier layers

dc.contributor.authorPalmans, Roger
dc.date.accessioned2021-10-16T03:51:29Z
dc.date.available2021-10-16T03:51:29Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10973
dc.sourceIIOimport
dc.titleDirect copper plating on highly resistive barrier layers
dc.typeMeeting abstract
dc.source.peerreviewno
dc.source.beginpage667
dc.source.conferenceMeeting Abstracts 208th Meeting of the Electrochemical Society. Science, Technology, and Tools for Electrodeposition
dc.source.conferencedate17/10/2005
dc.source.conferencelocationLos Angeles, CA USA
imec.availabilityPublished - imec


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