Show simple item record

Thin-film multi-chip module technology in high-resistivity Si for the integration of millimeter wave systems

dc.contributor.authorPosada Quijano, Guillermo
dc.contributor.authorCarchon, Geert
dc.contributor.authorPoesen, Gert
dc.contributor.authorNauwelaers, Bart
dc.contributor.authorDe Raedt, Walter
dc.date.accessioned2021-10-16T04:11:51Z
dc.date.available2021-10-16T04:11:51Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11042
dc.sourceIIOimport
dc.titleThin-film multi-chip module technology in high-resistivity Si for the integration of millimeter wave systems
dc.typeProceedings paper
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.source.peerreviewno
dc.source.beginpage12
dc.source.conferenceNEFERTITI Workshop on Millimetre Wave Photonic Devices and Technologies for Wireless and Imaging Applications
dc.source.conferencedate17/01/2005
dc.source.conferencelocationBrussel Belgium
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record