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Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads
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Authors
Ratchev, Petar
;
Stoukatch, Serguei
;
Swinnen, Bart
Journal
Microelectronics Reliability
Title
Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads
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