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Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads

dc.contributor.authorRatchev, Petar
dc.contributor.authorStoukatch, Serguei
dc.contributor.authorSwinnen, Bart
dc.date.accessioned2021-10-16T04:25:47Z
dc.date.available2021-10-16T04:25:47Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11086
dc.sourceIIOimport
dc.titleMechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads
dc.typeJournal article
dc.contributor.imecauthorSwinnen, Bart
dc.source.peerreviewno
dc.source.journalMicroelectronics Reliability
imec.availabilityPublished - imec
imec.internalnotesIn Press, Corrected Proof, Available online 20 December 2005


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