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Effect of the intermetallics particles size on the brittle to ductile fracture transition in a bulk Sn-4wt%Ag-0.5wt% Cu solder

dc.contributor.authorRatchev, Petar
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVerlinden, Bert
dc.date.accessioned2021-10-16T04:26:04Z
dc.date.available2021-10-16T04:26:04Z
dc.date.issued2005-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11087
dc.sourceIIOimport
dc.titleEffect of the intermetallics particles size on the brittle to ductile fracture transition in a bulk Sn-4wt%Ag-0.5wt% Cu solder
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewno
dc.source.conferenceIPC/JEDEC 10th International Conference on Lead Free Electronic Components and Assemblies
dc.source.conferencedate18/10/2005
dc.source.conferencelocationBrussels Belgium
imec.availabilityPublished - imec
imec.internalnotesCD-ROM proceedings


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