Show simple item record

Packaging solution with a 3-dimensional alignment approach for 2-dimensional parallel direct optical interconnects to the chip

dc.contributor.authorRits, Olivier
dc.contributor.authorBockstaele, R.
dc.contributor.authorNaessens, Kris
dc.contributor.authorBaets, Roel
dc.date.accessioned2021-10-16T04:31:53Z
dc.date.available2021-10-16T04:31:53Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11106
dc.sourceIIOimport
dc.titlePackaging solution with a 3-dimensional alignment approach for 2-dimensional parallel direct optical interconnects to the chip
dc.typeProceedings paper
dc.contributor.imecauthorRits, Olivier
dc.contributor.imecauthorBaets, Roel
dc.contributor.orcidimecBaets, Roel::0000-0003-1266-1319
dc.source.peerreviewno
dc.source.beginpage133
dc.source.endpage138
dc.source.conferenceProceedings 15th European Microelectronics and Packaging Conference - EPMC
dc.source.conferencedate12/06/2005
dc.source.conferencelocationBrugge Belgium
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record