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Atomic-layer deposited barrier and seed layers for interconnects

dc.contributor.authorSchuhmacher, Jorg
dc.contributor.authorMartin Hoyas, Ana
dc.contributor.authorSatta, Alessandra
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-16T04:55:58Z
dc.date.available2021-10-16T04:55:58Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11181
dc.sourceIIOimport
dc.titleAtomic-layer deposited barrier and seed layers for interconnects
dc.typeBook chapter
dc.contributor.imecauthorMaex, Karen
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage39
dc.source.bookMaterials for Information Technology. Devices, Interconnects and Packaging
dc.source.endpage50
imec.availabilityPublished - open access
imec.internalnotesPaper from EUROMAT 2003


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