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Interface evolution of epoxy layers due to wet-chemical treatments and its relevance to adhesion of electrochemically deposited copper

dc.contributor.authorSiau, S.
dc.contributor.authorVervaet, A.
dc.contributor.authorSchacht, E.
dc.contributor.authorVan Calster, Andre
dc.date.accessioned2021-10-16T05:01:35Z
dc.date.available2021-10-16T05:01:35Z
dc.date.issued2005-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11198
dc.sourceIIOimport
dc.titleInterface evolution of epoxy layers due to wet-chemical treatments and its relevance to adhesion of electrochemically deposited copper
dc.typeMeeting abstract
dc.contributor.imecauthorVan Calster, Andre
dc.source.peerreviewno
dc.source.beginpage348
dc.source.conferenceMeeting Abstracts of the 207th meeting of The Electrochemical Society
dc.source.conferencedate15/05/2005
dc.source.conferencelocationQuebec Canada
imec.availabilityPublished - imec


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