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The development of epoxy polymer surface roughness due to wet chemical treatments and its relevance to adhesion of electrochemically deposited copper

dc.contributor.authorSiau, S.
dc.contributor.authorVervaet, A.
dc.contributor.authorVan Calster, Andre
dc.contributor.authorBaert, D.
dc.date.accessioned2021-10-16T05:01:54Z
dc.date.available2021-10-16T05:01:54Z
dc.date.issued2005-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11199
dc.sourceIIOimport
dc.titleThe development of epoxy polymer surface roughness due to wet chemical treatments and its relevance to adhesion of electrochemically deposited copper
dc.typeProceedings paper
dc.contributor.imecauthorVan Calster, Andre
dc.source.peerreviewno
dc.source.beginpage22
dc.source.conference5th International Symposium on Polymer Surface Modification
dc.source.conferencedate20/06/2005
dc.source.conferencelocationToronto Canada
imec.availabilityPublished - imec


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