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Adhesion strength of the epoxy polymer/copper interface for use in microelectronics

dc.contributor.authorSiau, S.
dc.contributor.authorVervaet, A.
dc.contributor.authorVan Vaeck, L.
dc.contributor.authorSchacht, E.
dc.contributor.authorDemeter, U.
dc.contributor.authorVan Calster, Andre
dc.date.accessioned2021-10-16T05:02:13Z
dc.date.available2021-10-16T05:02:13Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11200
dc.sourceIIOimport
dc.titleAdhesion strength of the epoxy polymer/copper interface for use in microelectronics
dc.typeJournal article
dc.contributor.imecauthorVan Calster, Andre
dc.source.peerreviewno
dc.source.beginpagec442
dc.source.endpagec455
dc.source.journalJournal of the Electrochemical Society
dc.source.issue6
dc.source.volume152
imec.availabilityPublished - imec


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