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imec Publications
Articles
Nuovi concetti per il packaging a livello di wafer
Publication:
Nuovi concetti per il packaging a livello di wafer
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Date
2005-10
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Snoeckx, Koen
;
Beyne, Eric
Journal
PCB Magazine
Abstract
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1891
since deposited on 2021-10-16
Acq. date: 2026-02-25
Citations
Statistics
Views
1891
since deposited on 2021-10-16
Acq. date: 2026-02-25
Citations