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Nuovi concetti per il packaging a livello di wafer

dc.contributor.authorSnoeckx, Koen
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-16T05:14:06Z
dc.date.available2021-10-16T05:14:06Z
dc.date.issued2005-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11236
dc.sourceIIOimport
dc.titleNuovi concetti per il packaging a livello di wafer
dc.typeJournal article
dc.contributor.imecauthorSnoeckx, Koen
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage30
dc.source.endpage33
dc.source.journalPCB Magazine
dc.source.issueOttobre
imec.availabilityPublished - imec


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