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Combining BCB with KOH : wet bulk micromachining vs. wafer bonding

dc.contributor.authorSterken, Tom
dc.contributor.authorFiorini, Paolo
dc.contributor.authorPuers, Bob
dc.date.accessioned2021-10-16T05:26:07Z
dc.date.available2021-10-16T05:26:07Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11272
dc.sourceIIOimport
dc.titleCombining BCB with KOH : wet bulk micromachining vs. wafer bonding
dc.typeProceedings paper
dc.contributor.imecauthorSterken, Tom
dc.contributor.imecauthorPuers, Bob
dc.source.peerreviewyes
dc.source.beginpage80
dc.source.endpage83
dc.source.conference16th MicroMechanics Europe Workshop - MME
dc.source.conferencedate4/09/2005
dc.source.conferencelocationGöteborg Sweden
imec.availabilityPublished - imec
imec.internalnotesP-13


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