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FCOB: packaging issues for RF-MEMS applications and reliability study

dc.contributor.authorStoukatch, Serguei
dc.contributor.authorWebers, Tomas
dc.contributor.authorWinters, Christophe
dc.contributor.authorRatchev, Petar
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBaert, Kris
dc.contributor.authorBeyne, Eric
dc.contributor.authorOya, Yoichi
dc.contributor.authorOkubora, Akihiko
dc.date.accessioned2021-10-16T05:30:48Z
dc.date.available2021-10-16T05:30:48Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11286
dc.sourceIIOimport
dc.titleFCOB: packaging issues for RF-MEMS applications and reliability study
dc.typeProceedings paper
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorWinters, Christophe
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage195
dc.source.endpage200
dc.source.conferenceProceedings 15th European Microelectronics and Packaging Conference - EPMC
dc.source.conferencedate12/06/2005
dc.source.conferencelocationBrugge Belgium
imec.availabilityPublished - imec


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