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Low-damage damascene patterning of SiOC(H) low-k dielectrics

dc.contributor.authorStruyf, Herbert
dc.contributor.authorHendrickx, Dirk
dc.contributor.authorVan Olmen, Jan
dc.contributor.authorIacopi, Francesca
dc.contributor.authorRichard, Olivier
dc.contributor.authorTravaly, Youssef
dc.contributor.authorVan Hove, Marleen
dc.contributor.authorBoullart, Werner
dc.contributor.authorVanhaelemeersch, Serge
dc.date.accessioned2021-10-16T05:31:53Z
dc.date.available2021-10-16T05:31:53Z
dc.date.issued2005-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11289
dc.sourceIIOimport
dc.titleLow-damage damascene patterning of SiOC(H) low-k dielectrics
dc.typeProceedings paper
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorHendrickx, Dirk
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorBoullart, Werner
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.source.peerreviewyes
dc.source.beginpage30
dc.source.endpage32
dc.source.conferenceProceedings of the IEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate6/06/2005
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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