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High-Q on-chip inductors using thin-film wafer level packaging technology demonstrated on a 90nm RF-CMOS 5GHz VCO

dc.contributor.authorSun, Xiao
dc.contributor.authorLinten, Dimitri
dc.contributor.authorDupuis, Olivier
dc.contributor.authorCarchon, Geert
dc.contributor.authorSoussan, Philippe
dc.contributor.authorDecoutere, Stefaan
dc.contributor.authorDe Raedt, Walter
dc.date.accessioned2021-10-16T05:33:26Z
dc.date.available2021-10-16T05:33:26Z
dc.date.issued2005-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11293
dc.sourceIIOimport
dc.titleHigh-Q on-chip inductors using thin-film wafer level packaging technology demonstrated on a 90nm RF-CMOS 5GHz VCO
dc.typeProceedings paper
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorLinten, Dimitri
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorDecoutere, Stefaan
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.orcidimecLinten, Dimitri::0000-0001-8434-1838
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecDecoutere, Stefaan::0000-0001-6632-6239
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.source.peerreviewno
dc.source.beginpage77
dc.source.endpage80
dc.source.conferenceProceedings European Microwave Conference
dc.source.conferencedate3/10/2005
dc.source.conferencelocationParis France
imec.availabilityPublished - imec


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