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Barrier integrity and reliablility in copper low-k interconnects

dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-16T05:43:54Z
dc.date.available2021-10-16T05:43:54Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11322
dc.sourceIIOimport
dc.titleBarrier integrity and reliablility in copper low-k interconnects
dc.typeProceedings paper
dc.contributor.imecauthorTokei, Zsolt
dc.source.peerreviewno
dc.source.beginpage386
dc.source.endpage395
dc.source.conferenceInternational Semiconductor Technology Conference - ISTC
dc.source.conferencedate15/03/2005
dc.source.conferencelocationShangai China
imec.availabilityPublished - imec


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