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Comprehensive study of postprocessed copper heat sinks on smart power drivers for thermal SOA improvement

dc.contributor.authorVan den Bosch, Geert
dc.contributor.authorDriessens, Evelien
dc.contributor.authorWebers, Tomas
dc.contributor.authorElattari, Brahim
dc.contributor.authorWojchiechowski, Dominique
dc.contributor.authorGassot, Pierre
dc.contributor.authorMoens, Peter
dc.contributor.authorGroeseneken, Guido
dc.date.accessioned2021-10-16T06:00:42Z
dc.date.available2021-10-16T06:00:42Z
dc.date.issued2005-04
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11370
dc.sourceIIOimport
dc.titleComprehensive study of postprocessed copper heat sinks on smart power drivers for thermal SOA improvement
dc.typeProceedings paper
dc.contributor.imecauthorVan den Bosch, Geert
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorMoens, Peter
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.orcidimecVan den Bosch, Geert::0000-0001-9971-6954
dc.source.peerreviewno
dc.source.beginpage652
dc.source.endpage653
dc.source.conferenceProceedings International Reliability Physics Symposium
dc.source.conferencedate17/04/2005
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - imec


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