dc.contributor.author | Van Steenberge, Nele | |
dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Schildermans, Inge | |
dc.contributor.author | Willems, Geert | |
dc.date.accessioned | 2021-10-16T06:26:07Z | |
dc.date.available | 2021-10-16T06:26:07Z | |
dc.date.issued | 2005-04 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/11442 | |
dc.source | IIOimport | |
dc.title | Analytical and finite element models of the thermal behaviour for lead-free soldering processes in electronic assembly | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.imecauthor | Willems, Geert | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.contributor.orcidimec | Willems, Geert::0000-0002-9137-618X | |
dc.source.peerreview | no | |
dc.source.beginpage | 675 | |
dc.source.endpage | 680 | |
dc.source.conference | Proceedings of the 6th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics | |
dc.source.conferencedate | 17/04/2005 | |
dc.source.conferencelocation | Berlin Germany | |
imec.availability | Published - imec | |