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Flip chip on flex versus on PCB: impact on thermal management

dc.contributor.authorVandevelde, Bart
dc.date.accessioned2021-10-16T06:36:53Z
dc.date.available2021-10-16T06:36:53Z
dc.date.issued2005-11
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11473
dc.sourceIIOimport
dc.titleFlip chip on flex versus on PCB: impact on thermal management
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewno
dc.source.beginpage1
dc.source.endpage6
dc.source.conferenceBe-Flexible Workshop
dc.source.conferencedate23/11/2005
dc.source.conferencelocationMünchen Germany
imec.availabilityPublished - imec


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