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Issues for megasonic cleaning without damaging

dc.contributor.authorVereecke, Guy
dc.contributor.authorHolsteyns, Frank
dc.contributor.authorArnauts, Sophia
dc.contributor.authorBeckx, Stephan
dc.contributor.authorJaenen, Patrick
dc.contributor.authorKenis, Karine
dc.contributor.authorLismont, Mark
dc.contributor.authorLux, Marcel
dc.contributor.authorVos, Rita
dc.contributor.authorSnow, Jim
dc.contributor.authorMertens, Paul
dc.date.accessioned2021-10-16T06:48:44Z
dc.date.available2021-10-16T06:48:44Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11505
dc.sourceIIOimport
dc.titleIssues for megasonic cleaning without damaging
dc.typeProceedings paper
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.imecauthorArnauts, Sophia
dc.contributor.imecauthorBeckx, Stephan
dc.contributor.imecauthorJaenen, Patrick
dc.contributor.imecauthorKenis, Karine
dc.contributor.imecauthorLismont, Mark
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorMertens, Paul
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.source.peerreviewno
dc.source.conferenceSCP 9th International Symposium on Wafer Cleaning and Surface Preparation
dc.source.conferencedate8/06/2005
dc.source.conferencelocationBoise, ID USA
imec.availabilityPublished - imec


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