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Preliminary hard X-ray micro-spectroscopic investigations on thin-film Ta-and-W based diffusion barriers for copper interconnect technology

dc.contributor.authorAblett, J.M.
dc.contributor.authorWoicik, J.C.
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-16T15:00:00Z
dc.date.available2021-10-16T15:00:00Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11617
dc.sourceIIOimport
dc.titlePreliminary hard X-ray micro-spectroscopic investigations on thin-film Ta-and-W based diffusion barriers for copper interconnect technology
dc.typeProceedings paper
dc.contributor.imecauthorTokei, Zsolt
dc.source.peerreviewno
dc.source.beginpage1557
dc.source.endpage1560
dc.source.conference9th International Conference on Synchrotron Radiation Instrumentation
dc.source.conferencedate28/05/2006
dc.source.conferencelocationDaegu Korea
imec.availabilityPublished - imec
imec.internalnotesAIP Conference Proc.; Vol. 879


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