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Elastic and conformable electronic circuits and assembies using MID in polymer

dc.contributor.authorAxisa, Fabrice
dc.contributor.authorBrosteaux, Dominique
dc.contributor.authorDe Leersnyder, Eva
dc.contributor.authorBossuyt, F.
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVanden Bulcke, Mathieu
dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-10-16T15:01:09Z
dc.date.available2021-10-16T15:01:09Z
dc.date.issued2007-01
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11664
dc.sourceIIOimport
dc.titleElastic and conformable electronic circuits and assembies using MID in polymer
dc.typeProceedings paper
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVanden Bulcke, Mathieu
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage280
dc.source.endpage286
dc.source.conference6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics - Polytronic
dc.source.conferencedate16/01/2007
dc.source.conferencelocationTokio Japan
imec.availabilityPublished - open access


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