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Laser bonding of glass to silicon using polymer for microsystems packaging

dc.contributor.authorBardin, Fabrice
dc.contributor.authorKloss, Stephan
dc.contributor.authorWang, Changhai
dc.contributor.authorMoore, Andrew J.
dc.contributor.authorJourdain, Anne
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorHand, Duncan P.
dc.date.accessioned2021-10-16T15:02:36Z
dc.date.available2021-10-16T15:02:36Z
dc.date.issued2007-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11696
dc.sourceIIOimport
dc.titleLaser bonding of glass to silicon using polymer for microsystems packaging
dc.typeJournal article
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewno
dc.source.beginpage571
dc.source.endpage580
dc.source.journalJournal of Microelectromechanical Systems
dc.source.issue3
dc.source.volume16
imec.availabilityPublished - imec


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