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Cost-effective 3D-system integration using through silicon via technologies

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-16T15:05:09Z
dc.date.available2021-10-16T15:05:09Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11736
dc.sourceIIOimport
dc.titleCost-effective 3D-system integration using through silicon via technologies
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceInternational Microsystems, Packaging, Assembly and Circuits conference - IMPACT
dc.source.conferencedate1/10/2007
dc.source.conferencelocationTaipei Taiwan
imec.availabilityPublished - imec


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