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Cost effective 3D-system integration using through-silicon-via technologies

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-16T15:05:17Z
dc.date.available2021-10-16T15:05:17Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11738
dc.sourceIIOimport
dc.titleCost effective 3D-system integration using through-silicon-via technologies
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceSemi Technical Symposium,Session 9: Packaging Progressing 3D Jisso Technology, Semicon
dc.source.conferencedate5/12/2007
dc.source.conferencelocationChiba Japan
imec.availabilityPublished - imec


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