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Process and material requirements for successful heterogonous passive component integration in RF system

dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorCarchon, Geert
dc.contributor.authorSoussan, Philippe
dc.date.accessioned2021-10-16T15:05:21Z
dc.date.available2021-10-16T15:05:21Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11739
dc.sourceIIOimport
dc.titleProcess and material requirements for successful heterogonous passive component integration in RF system
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.source.peerreviewno
dc.source.beginpage13
dc.source.endpage22
dc.source.conferenceAdvanced Electronic Packaging
dc.source.conferencedate27/11/2006
dc.source.conferencelocationBoston, MA USA
imec.availabilityPublished - imec
imec.internalnotesMRS Symposium Proceedings; Vol. 968


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