dc.contributor.author | Biesemans, Leen | |
dc.contributor.author | Vanstreels, Kris | |
dc.contributor.author | Brongersma, Sywert | |
dc.contributor.author | D'Haen, Jan | |
dc.contributor.author | De Ceuninck, Ward | |
dc.contributor.author | D'Olieslaeger, Marc | |
dc.date.accessioned | 2021-10-16T15:05:50Z | |
dc.date.available | 2021-10-16T15:05:50Z | |
dc.date.issued | 2007 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/11746 | |
dc.source | IIOimport | |
dc.title | Microstructural evolution of Cu interconnect under AC, pulsed DC and DC current stress | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Vanstreels, Kris | |
dc.contributor.imecauthor | Brongersma, Sywert | |
dc.contributor.imecauthor | D'Haen, Jan | |
dc.contributor.imecauthor | De Ceuninck, Ward | |
dc.contributor.imecauthor | D'Olieslaeger, Marc | |
dc.contributor.orcidimec | Vanstreels, Kris::0000-0002-4420-0966 | |
dc.contributor.orcidimec | Brongersma, Sywert::0000-0002-1755-3897 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 453 | |
dc.source.endpage | 458 | |
dc.source.conference | Advanced Metallization Conference 2006 | |
dc.source.conferencedate | 17/10/2006 | |
dc.source.conferencelocation | San Diego, CA USA | |
imec.availability | Published - open access | |
imec.internalnotes | Conference Proceedings AMC XXII | |