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Thickness characterization of ultra thin wafers on carrier

dc.contributor.authorCotrin Teixeira, Ricardo
dc.contributor.authorDe Munck, Koen
dc.contributor.authorBaert, Kris
dc.contributor.authorSwinnen, Bart
dc.contributor.authorKnüttel, Alexsander
dc.contributor.authorDe Moor, Piet
dc.date.accessioned2021-10-16T15:23:43Z
dc.date.available2021-10-16T15:23:43Z
dc.date.issued2007-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11906
dc.sourceIIOimport
dc.titleThickness characterization of ultra thin wafers on carrier
dc.typeProceedings paper
dc.contributor.imecauthorDe Munck, Koen
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorDe Moor, Piet
dc.source.peerreviewno
dc.source.beginpage238
dc.source.endpage241
dc.source.conference9th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate10/12/2007
dc.source.conferencelocationSingapore
imec.availabilityPublished - imec


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