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Stress analysis on ultra thin ground wafers

dc.contributor.authorCotrin Teixeira, Ricardo
dc.contributor.authorDe Munck, Koen
dc.contributor.authorDe Moor, Piet
dc.contributor.authorBaert, Kris
dc.contributor.authorSwinnen, Bart
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorKnüttel, Alexsander
dc.date.accessioned2021-10-16T15:23:52Z
dc.date.available2021-10-16T15:23:52Z
dc.date.issued2007-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11907
dc.sourceIIOimport
dc.titleStress analysis on ultra thin ground wafers
dc.typeProceedings paper
dc.contributor.imecauthorDe Munck, Koen
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorVan Hoof, Chris
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage113
dc.source.endpage121
dc.source.conferenceMicroelectronics Technology and Devices - SBMICRO
dc.source.conferencedate3/09/2007
dc.source.conferencelocationRio de Janeiro Brazil
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 9, issue 1


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