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Advanced wafer thinning for 3D applications

dc.contributor.authorDe Moor, Piet
dc.date.accessioned2021-10-16T15:31:44Z
dc.date.available2021-10-16T15:31:44Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11959
dc.sourceIIOimport
dc.titleAdvanced wafer thinning for 3D applications
dc.typeOral presentation
dc.contributor.imecauthorDe Moor, Piet
dc.source.peerreviewno
dc.source.conferenceENCASIT/GOOD-DIE International Workshop CAST - Challenges on Advanced Semiconductor-die Technologies
dc.source.conferencedate25/06/2007
dc.source.conferencelocationPortsmouth United Kingdom
imec.availabilityPublished - imec


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