Show simple item record

Wafer level high density 3D integration technologies for space applications

dc.contributor.authorDe Moor, Piet
dc.contributor.authorDe Munck, Koen
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorSwinnen, Bart
dc.contributor.authorVan Hoof, Chris
dc.date.accessioned2021-10-16T15:32:10Z
dc.date.available2021-10-16T15:32:10Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11962
dc.sourceIIOimport
dc.titleWafer level high density 3D integration technologies for space applications
dc.typeOral presentation
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorDe Munck, Koen
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.source.peerreviewno
dc.source.conference6th Round Table on Micro/Nano Technologies for Space
dc.source.conferencedate8/10/2007
dc.source.conferencelocationESTEC - Noordwijk Te Netherlands
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record