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Development of a new post-etch photoresist stripper for copper BEOL process

dc.contributor.authorDu, Bing
dc.contributor.authorKneer, Emil
dc.contributor.authorTownsend, P.H.
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorHendrickx, Dirk
dc.contributor.authorVereecke, Guy
dc.date.accessioned2021-10-16T15:57:12Z
dc.date.available2021-10-16T15:57:12Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12105
dc.sourceIIOimport
dc.titleDevelopment of a new post-etch photoresist stripper for copper BEOL process
dc.typeProceedings paper
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorHendrickx, Dirk
dc.contributor.imecauthorVereecke, Guy
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conference24th International VLSI-ULSI Multilevel Interconnection Conference - VMIC
dc.source.conferencedate24/09/2007
dc.source.conferencelocationFremont, CA USA
imec.availabilityPublished - open access


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