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Analog design challenges and trade-offs using emerging materials and devices

dc.contributor.authorFulde, Michael
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorGustin, Cedric
dc.contributor.authorParvais, Bertrand
dc.contributor.authorSubramanian, Vaidy
dc.contributor.authorvon Arnim, Klaus
dc.contributor.authorBauer, F.
dc.contributor.authorSchruefer, K.
dc.contributor.authorSchmitt-Landsiedel, D.
dc.contributor.authorKnoblinger, Gerald
dc.date.accessioned2021-10-16T16:11:13Z
dc.date.available2021-10-16T16:11:13Z
dc.date.issued2007-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12172
dc.sourceIIOimport
dc.titleAnalog design challenges and trade-offs using emerging materials and devices
dc.typeProceedings paper
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorParvais, Bertrand
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.contributor.orcidimecParvais, Bertrand::0000-0003-0769-7069
dc.source.peerreviewyes
dc.source.beginpage123
dc.source.endpage126
dc.source.conferenceProceedings of the 37th European Solid-State Device Research Conference - ESSDERC
dc.source.conferencedate11/09/2007
dc.source.conferencelocationMünchen Germany
imec.availabilityPublished - imec


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