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A new generic surface micromachining module for MEMS hermetic packaging at temperatures below 200° C

dc.contributor.authorHellin Rico, Raquel
dc.contributor.authorCelis, Jean-Pierre
dc.contributor.authorBaert, Kris
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorWitvrouw, Ann
dc.date.accessioned2021-10-16T16:32:59Z
dc.date.available2021-10-16T16:32:59Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12265
dc.sourceIIOimport
dc.titleA new generic surface micromachining module for MEMS hermetic packaging at temperatures below 200° C
dc.typeJournal article
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecVan Hoof, Chris::0000-0002-4645-3326
dc.source.peerreviewno
dc.source.beginpage1451
dc.source.endpage1456
dc.source.journalMicrosystem Technologies
dc.source.issue11_12
dc.source.volume13
imec.availabilityPublished - imec


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