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The effect of delay between dry etch and wet clean processing steps on cleaning of post-etch residues
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The effect of delay between dry etch and wet clean processing steps on cleaning of post-etch residues
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Date
2007
Proceedings Paper
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14818.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Hellin, David
;
Vos, Ingrid
;
Vereecke, Guy
;
Pavel, E.
;
Boullart, Werner
;
Vertommen, Johan
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1848
since deposited on 2021-10-16
Acq. date: 2026-01-09
Citations
Metrics
Views
1848
since deposited on 2021-10-16
Acq. date: 2026-01-09
Citations