dc.contributor.author | Hoofman, Romano | |
dc.contributor.author | Nguyen Hoang, Viet | |
dc.contributor.author | Arnal, V. | |
dc.contributor.author | Broekaart, M. | |
dc.contributor.author | Gosset, L.G. | |
dc.contributor.author | Besling, W.F.A. | |
dc.contributor.author | Fayolle, M. | |
dc.contributor.author | Iacopi, Francesca | |
dc.date.accessioned | 2021-10-16T16:42:26Z | |
dc.date.available | 2021-10-16T16:42:26Z | |
dc.date.issued | 2007 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/12305 | |
dc.source | IIOimport | |
dc.title | Integration of low-k dielectric films in damascene processes | |
dc.type | Book chapter | |
dc.contributor.imecauthor | Hoofman, Romano | |
dc.contributor.orcidimec | Hoofman, Romano::0000-0001-8740-104X | |
dc.source.peerreview | no | |
dc.source.beginpage | 199 | |
dc.source.book | Dielectric Films for Advanced Microelectronics | |
dc.source.endpage | 250 | |
imec.availability | Published - imec | |
imec.internalnotes | Wiley Series in Materials for Electronic and Optoelectronic Applications | |