Influence of stress-induced leakage current on reliability of HfSiOx
dc.contributor.author | Jakschik, S. | |
dc.contributor.author | Kauerauf, Thomas | |
dc.contributor.author | Degraeve, Robin | |
dc.contributor.author | Hwang, Young Nam | |
dc.contributor.author | Duschl, R. | |
dc.contributor.author | Kerber, M. | |
dc.contributor.author | Avellan, A. | |
dc.contributor.author | Kudelka, S. | |
dc.date.accessioned | 2021-10-16T16:53:23Z | |
dc.date.available | 2021-10-16T16:53:23Z | |
dc.date.issued | 2007 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/12348 | |
dc.source | IIOimport | |
dc.title | Influence of stress-induced leakage current on reliability of HfSiOx | |
dc.type | Journal article | |
dc.contributor.imecauthor | Degraeve, Robin | |
dc.source.peerreview | no | |
dc.source.beginpage | 310 | |
dc.source.endpage | 314 | |
dc.source.journal | IEEE Trans. Device and Materials Reliability | |
dc.source.issue | 2 | |
dc.source.volume | 7 | |
imec.availability | Published - imec |
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