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BCB collective bonding for 3D stacking

dc.contributor.authorJourdain, Anne
dc.contributor.authorDe Moor, Piet
dc.contributor.authorPargfrieder, Stefan
dc.contributor.authorBaert, Kris
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-16T16:59:35Z
dc.date.available2021-10-16T16:59:35Z
dc.date.issued2007-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12372
dc.sourceIIOimport
dc.titleBCB collective bonding for 3D stacking
dc.typeMeeting abstract
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceInternational Workshop on Wafer Bonding for MEMS Technologies and Wafer Level Integration
dc.source.conferencedate9/12/2007
dc.source.conferencelocationHalle Germany
imec.availabilityPublished - imec


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