Show simple item record

Alternative photoresist removal process to minimize damage of low-k material induced by ash plasma

dc.contributor.authorLe, Quoc Toan
dc.contributor.authorKeldermans, Johan
dc.contributor.authorChiodarelli, Nicolo
dc.contributor.authorKesters, Els
dc.contributor.authorLux, Marcel
dc.contributor.authorClaes, Martine
dc.contributor.authorVereecke, Guy
dc.date.accessioned2021-10-16T17:21:33Z
dc.date.available2021-10-16T17:21:33Z
dc.date.issued2007-11
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12454
dc.sourceIIOimport
dc.titleAlternative photoresist removal process to minimize damage of low-k material induced by ash plasma
dc.typeProceedings paper
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorVereecke, Guy
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.source.peerreviewno
dc.source.beginpage37
dc.source.endpage38
dc.source.conferenceInternational Symposium on Dry Process
dc.source.conferencedate13/11/2007
dc.source.conferencelocationTokyo Japan
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record