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dc.contributor.authorLee, F.
dc.contributor.authorMarcus, S.
dc.contributor.authorShero, E.
dc.contributor.authorWilk, G.
dc.contributor.authorSwerts, Johan
dc.contributor.authorMaes, Jan
dc.contributor.authorBlomberg, T.
dc.contributor.authorDelabie, Annelies
dc.contributor.authorGros-Jean, M.
dc.contributor.authorDeloffre, E.
dc.date.accessioned2021-10-16T17:21:51Z
dc.date.available2021-10-16T17:21:51Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12455
dc.sourceIIOimport
dc.titleAtomic layer deposition: an enabling technology for microelectronic device manufacturing
dc.typeProceedings paper
dc.contributor.imecauthorSwerts, Johan
dc.contributor.imecauthorMaes, Jan
dc.contributor.imecauthorDelabie, Annelies
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage359
dc.source.endpage365
dc.source.conferenceIEEE/SEMI Advanced Semiconductor Manufacturing Conference
dc.source.conferencedate11/06/2007
dc.source.conferencelocationStresa Italy
imec.availabilityPublished - open access


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