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Real time investigation of conduction mechanism with bias stress in silica-based intermetal dielectrics

dc.contributor.authorLi, Yunlong
dc.contributor.authorGroeseneken, Guido
dc.contributor.authorMaex, Karen
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-16T17:28:22Z
dc.date.available2021-10-16T17:28:22Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12479
dc.sourceIIOimport
dc.titleReal time investigation of conduction mechanism with bias stress in silica-based intermetal dielectrics
dc.typeJournal article
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.imecauthorMaex, Karen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.source.peerreviewno
dc.source.beginpage252
dc.source.endpage258
dc.source.journalIEEE Trans. Device and Materials Reliability
dc.source.issue2
dc.source.volume7
imec.availabilityPublished - imec


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